For system-in-package (SIP) on laminate applications, the Hysol GR9810 epoxy molding compound is designed for use as an over-mold on a variety of laminate-based molded array packages including SIP and ...
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I broke all the rules with epoxy
In this video, I conducted an epoxy pouring experiment, casting 8 gallons of epoxy resin in a single pour, significantly ...
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Silicone Molds and Epoxy Resin Stunning Results
Ready to dive into the world of epoxy resin and silicone molds? In this video, I’ll take you step-by-step through the process of creating beautiful, glossy resin pieces that will blow your mind. From ...
Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Aiming to meet rising demands for carbon fiber composite unmanned aerial vehicle (UAV) propellers, Mejzlik Propellers has added compression molding capabilities coupled with a snap-cure epoxy prepreg.
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